Sudiyatno (2014) INDUSTRY INTERNSHIP IN LOCAL INDUSTRIES TO IMPROVE ENGINEERING DESIGN COMPETENCE OF UNDERGRADUATE ENGINEERING STUDENTS. International Conference On Vocational Education And Training (ICVET) May 14 th, 2014. ISSN 2301-7147
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Abstract
The aim of this study is to design a model of industry internship program in local industries for undergraduate engineering students to improve their engineering design competence. The students take this industry internship model in two months. During this program, the students, working in groups, design a machine or device that is needed by the local industries at that time. Methods used to analyse the effectiveness of the internship program in improving student’s engineering design competence were observation during the program and product performance test. There were three groups of students taking the internship program in two different local industries. The student’s engineering design competence were assessed in four different attributes: knowledge of procedures, operational skills, social skills and cognitive skills. Then, the results of these assessment were compared with those of students taking conventional industry internship. The product performance test was done to assess the quality of the machine. Results of the test showed that in all attributes of the competence (knowledge of procedures, operational skills, social skills and cognitive skills of the students) were better than those of students taking conventional industry internship. Results from the product performance test showed that the machines produced by the students taking the program had worked well. Key words: industry internship, engineering design, competence, undergraduate student
Item Type: | Article |
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Uncontrolled Keywords: | industry internship, engineering design, competence, undergraduate student |
Subjects: | Prosiding > ICVET 2014 Prosiding |
Divisions: | Fakultas Teknik (FT) > Pendidikan > Pendidikan Teknik Elektronika |
Depositing User: | Eprints |
Date Deposited: | 31 Jul 2015 06:59 |
Last Modified: | 31 Jul 2015 06:59 |
URI: | http://eprints.uny.ac.id/id/eprint/24468 |
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