Dyah Darma, Andayani and Vilia Darma, Paramita (2012) DESIGNING NEW CONCEPT OF INTERNSHIP IN VOCATIONAL EDUCATION CURRICULUM: NEW APPROACH TO INCREASE ALUMNI ASSIMILATION IN WORKPLACES. International Conference on Vocational Education and Training (ICVET) 2012. ISSN 977-23017-14009
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Abstract
For many years, internship has been viewed as a key point in determining successful of vocational collage’s graduates in the workplace. However, in many cases, internship program has been less effective in developing student’s knowledge and skills due to several factors such as public policy, interrelationship between vocational collage and the industry, student’s capacity and the efficiency of teaching in a vocational collage. To evaluate this issue, Realistic Evaluation (RE) method was carried out to sort out major attributes regarding student’s internship by interviewing embedded group of people, in this case student, lecturer and employer. Based on this study, several recommendations are offered to improve current internship program namely careful plan and arrangement prior to student’s engagement to the workplaces which is needed to ensure the effectiveness of the program and further this includes in campus preparation. Initial preparation in campus including curriculum and policy to support internship program is discussed along with industry placement arrangement including conceptual methods on student work, mentoring and project reports. Meanwhile, arrangement in the workplace, such as setting a project is expected to help student to learn the implementation of science they have studied in the collage/university.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | internship, vocational education curriculum, realistic evaluation (RE) |
| Subjects: | Prosiding > ICVET 2012 Prosiding |
| Divisions: | Fakultas Teknik (FT) > Pendidikan > Pendidikan Teknik Elektronika |
| Depositing User: | Eprints |
| Date Deposited: | 31 Jul 2015 03:39 |
| Last Modified: | 31 Jul 2015 03:39 |
| URI: | http://eprints.uny.ac.id/id/eprint/24424 |
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